The SMT assembly lines are automated and allow you to manage the flow of production of the electronic boards with minimal manipulation by the operator.
All the phases, from the silk-screen drafting to the placement of the components up to the remelting of the solder, are made with the best machinery and most advanced systems, to provide the maximum guarantee of quality. Components in package 01005, ultrathin pitch BGA, LGA, QFN can be mounted. The conformity of the production process is constantly monitored and validated by automatic optical control systems, which 100% verify both the quality of the welds and the positioning of the components.
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